Micron outlines memory and storage roadmap through 2030

Micron Technology has laid out where its memory business is headed for the rest of the decade, and the answer is mostly AI. The company’s roadmap runs through 2030 and includes vertical high-bandwidth memory and flash storage that GPUs can access directly. The roadmap came out of a Micron technology webinar on October 21, 2026, led by President Scott DeBoer. The headline commitment: a new generation of high-bandwidth memory (HBM) every year through 2030. Micron’s sequence starts with HBM4 in 2026 and runs to HBM6 in 2030. Custom HBM and vertical HBM options are slated to begin in 2028. The vertical HBM concept, which Micron calls vHBM, targets bandwidth of approximately 2 TB/s. The company is aiming for energy use under 1 picojoule per bit. The other attention-grabber is GPU-accessible flash. Flash is the slower, cheaper, persistent storage that normally lives a few steps removed from the processor. Letting GPUs reach it more directly could, in principle, give AI systems a larger pool of usable data without paying HBM prices for all of it. DRAM and NAND get their own upgrades On the conventional DRAM side, Micron plans to bring its 1δ (1-delta) node into volume production in the se...