TSMC reportedly weighs 3D DRAM production at Nvidia’s request

The chipmaker's early-stage memory plans point to a long-term bet, not a quick fix for the AI-driven shortage TSMC has reportedly begun internal planning to manufacture advanced 3D DRAM memory chips at the request of Nvidia, one of its biggest customers. For a company that has historically stayed out of the memory business, that is a notable change of direction. The catch: anyone hoping this ends the current memory crunch soon may need to wait. The effort is still in its early stages, with no firm capital commitments and no production timeline attached. What TSMC is reportedly planning The reports surfaced on November 6, 2026. They describe TSMC exploring how it might produce 3D DRAM, a type of memory that builds upward rather than spreading out across a flat surface. The project is reportedly being led by Hsu Kuo-chin, TSMC’s vice president of Advanced Packaging. His team is said to be weighing several paths forward. Those options reportedly include building new fabrication facilities or adapting existing ones. Neither choice has been locked in. Why Nvidia is knocking on TSMC’s door The backdrop is a severe memory shortage driven by AI demand. That shortage is expected to weigh on...