SK Hynix plans to outsource next-generation HBM base die to Intel

SK Hynix, the world’s dominant supplier of high-bandwidth memory chips powering AI data centers, is reportedly in discussions to have Intel Foundry produce the base die for its next-generation HBM4E memory stacks. The move would mark a significant shift in the semiconductor supply chain, introducing Intel as a direct alternative to TSMC for one of the most critical components in AI hardware. The report, originating from Korean media outlet The Herald Business, signals that SK Hynix is no longer comfortable having a single supplier for the logic dies that sit at the foundation of its HBM stacks. Why the base die matters High-bandwidth memory works by vertically stacking multiple DRAM dies on top of a base die, which acts as the controller and interface between the memory and the processor. For HBM4, SK Hynix began outsourcing base die production to TSMC in 2026. But these base dies are expensive. They reportedly cost 3-4 times more than SK Hynix’s core DRAM dies, which means any cost reduction in this component flows straight to the bottom line. That’s where Intel enters the picture. Intel’s EMIB (Embedded Multi-die Interconnect Bridge) technology is being evaluated as an alternativ...